In PCB production, thermal design is a very important part, which will directly affect the quality and performance of PCB. The purpose of thermal design is to take appropriate measures and methods to reduce the temperature of components and PCB board, so that the system can work normally at the appropriate temperature. So, what are the methods of PCB thermal design?
1. Heat is dissipated by the PCB itself.
The best way to solve the heat dissipation is to improve the heat dissipation capacity of the PCB itself which is in direct contact with the heating element, and transmit or emit it through the PCB.
2. High heat generating device plus radiator and heat conducting plate.
When there are a few devices in the PCB with less than 3 heating capacity, a radiator or a heat pipe can be added to the heating device to enhance the heat dissipation effect. When the number of heating devices is more than 3, a large heat dissipation cover (plate) can be used to buckle the heat dissipation cover on the element surface as a whole and contact each element to dissipate heat.

3. Adopting reasonable wiring design to realize heat dissipation, improving the residual rate of copper foil and increasing heat conduction holes are the main means of heat dissipation.
4. When the high heat dissipation device is connected with the substrate, the thermal resistance between them should be reduced as much as possible.
5. In the horizontal direction, the high-power devices are arranged as close to the edge of the printed board as possible to shorten the heat transfer path; In the vertical direction, the high-power devices shall be arranged as close as possible to the top of the printed board to reduce the influence of these devices on the temperature of other devices.
6. The heat dissipation of the printed board in the equipment mainly depends on the air flow, so the air flow path should be studied and the devices should be configured reasonably during the design.
7. The device sensitive to temperature is best placed in the lowest temperature area, such as the bottom of the board.
8. The hot spots shall be evenly distributed on the PCB board as much as possible to keep the temperature performance of the PCB surface uniform and consistent.